Number Determination of Successfully Packaged Dies Per Wafer Based on Machine Vision
نویسندگان
چکیده
منابع مشابه
Number Determination of Successfully Packaged Dies Per Wafer Based on Machine Vision
Packaging the integrated circuit (IC) chip is a necessary step in the manufacturing process of IC products. In general, wafers with the same size and process should have a fixed number of packaged dies. However, many factors decrease the number of the actually packaged dies, such as die scratching, die contamination, and die breakage, which are not considered in the existing die-counting method...
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ژورنال
عنوان ژورنال: Machines
سال: 2015
ISSN: 2075-1702
DOI: 10.3390/machines3020072